*DO NOT FORGET TO CHECK IF THERE IS ANY FILTER SET IN THE MACHINE BEFORE STARTING YOUR WRITING!
*PLEASE UPDATE THE LAB BOOK AFTER EVERY USE! ALSO NOTE DOWN TECNICAL ISSUES IF YOU HAVE ANY!
*PLEASE DEFINE THE ORIGIN PROPERLY FOR THE WRITING AND WATCH THE LASER WRITER FOR SOME TIME (OR CHECK LATER) IF LASER IS NOT GOING OUT OF WORKING AREA! OTHERWISE, WRITING WILL BE INTERRUPTED.
About
Laserlithography system KLOE Dilase 250. Direct Laser exposure of photoresist on samples up to 4". Feature sizes of ~1µm are achievable. It can be used for:
- SU8 patterning microfluidics channels (up to 300 um channel height, minimal dimensions 10 um, maximum aspect ratio 5)
- Resist patterning for lift-off
Description
- 375 nm Laser
- Producing all pattern sizes on the nominal width basis of 1 μm laser spot
- Laser power on sample (max): 3.2mW @2022-10-19 (2 mW (255 kW/cm2))
- Vacuum chuck + motorized stages
- Manual focusing
- Vectorial writing mode for contours in both x and y-axis trajectories
- Scanning writing mode for filling of structures
- Possible to increase writing spot size by defocusing
- 3 neutral density filters allow large range of controllable laser intensity
- Mix&match lithography by alignment on given structures
- Exposure of gray scale resists possible
Process
Workflow
Design File
The mask design has to be done with the accompanying Kloe Design Software. It is possible to import GDSII or DXF files, but be prepared to take some time to optimize the files. From the design several LWO files are generated, these files can be used by the laser writer and writing parameters (modulation, velocity, focus) can be set on a per LWO file basis. Therefore it makes sense to split your design into several LWO files, each using a different set of parameters:
- fine, critical structures → written slowly and with highest resolution
- coarse structures → written faster, maybe defocused
The design may contain following basic elements:
Element | Explanation |
Trajectories | straight line segments, usually with a stabilization length |
Contours | lines, no stabilization length |
Fillings | filling of e.g. polygons, either line by line or spirally |
Dot Matrix | Laser is switched on only for a short time, resulting in a dot |
LWO files can be reimported into KLOE Design to simulate the writing process. This is highly recommended to check the file for errors and to estimate the required time.
Exposure Parameters
The following parameters influence the exposure of the resist and have to be determined experimentally:
- Laser intensity: Modulation (0-100%) and neutral density filter
- Writing speed
- Focus
Exposure
First, determine the optical focus of the sample surface. The laser focus is different due to the different wavelength. For each file:
- Offset
- Modulation
- Velocity
- Laser Focus
must be specified. Afterwards the exposure is started.
Filters
It is possible to use the filters to regulate the laser intensity for some applications.